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	<title>Marking | Picosecond Laser Oscillator Spectronix</title>
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		<title>Drilling and Internal Processing of Tempered Glass</title>
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		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Thu, 08 Jun 2023 05:15:38 +0000</pubDate>
				<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Drilling]]></category>
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		<category><![CDATA[LDH-G2510-en]]></category>
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					<description><![CDATA[<p>Plate Thickness: 700 μm Hole Diameter on the Light-Emitting Side: 4900 μm (large)　2750 μm (small) Hole Diamete [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/glass-material-en/5995/">Drilling and Internal Processing of Tempered Glass</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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