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	<title>Glass and Diamond | Picosecond Laser Oscillator Spectronix</title>
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	<description>超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</description>
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	<title>Glass and Diamond | Picosecond Laser Oscillator Spectronix</title>
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		<title>Deep hole drilling of glass</title>
		<link>https://www.spectronix.co.jp/en/material-en/6430/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=deep-hole-drilling-of-glass</link>
		
		<dc:creator><![CDATA[spectronix-wp]]></dc:creator>
		<pubDate>Fri, 04 Aug 2023 06:28:55 +0000</pubDate>
				<category><![CDATA[Examples of Processing（By Material）]]></category>
		<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Examples of Processing（By Type of Processing）]]></category>
		<category><![CDATA[Drilling]]></category>
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					<description><![CDATA[<p>Surface hole diameter: φ14um Back hole diameter: φ2um　 Even thick glass can be penetrated with high aspect rat [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/6430/">Deep hole drilling of glass</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
		
		
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		<title>Sapphire Glass Drilling（1）</title>
		<link>https://www.spectronix.co.jp/en/material-en/glass-material-en/5999/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25b5%25e3%2583%2595%25e3%2582%25a1%25e3%2582%25a4%25e3%2582%25a2%25e3%2582%25ac%25e3%2583%25a9%25e3%2582%25b9%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25911</link>
					<comments>https://www.spectronix.co.jp/en/material-en/glass-material-en/5999/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Sat, 10 Jun 2023 05:18:52 +0000</pubDate>
				<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5999</guid>

					<description><![CDATA[<p>Plate Thickness: 1000 μm Number of Holes: 16 (1.1 mm pitch) Hole Diameter on the Light-Emitting Side: 1000 μm  [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/glass-material-en/5999/">Sapphire Glass Drilling（1）</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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		<title>Sapphire Glass Drilling (2)</title>
		<link>https://www.spectronix.co.jp/en/material-en/glass-material-en/5997/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25b5%25e3%2583%2595%25e3%2582%25a1%25e3%2582%25a4%25e3%2582%25a2%25e3%2582%25ac%25e3%2583%25a9%25e3%2582%25b9%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25912</link>
					<comments>https://www.spectronix.co.jp/en/material-en/glass-material-en/5997/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Fri, 09 Jun 2023 05:17:22 +0000</pubDate>
				<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5997</guid>

					<description><![CDATA[<p>Plate Thickness: 300 μm Number of Holes: 16 (1.1 mm pitch) Hole Diameter on the Light-Emitting Side: 1030 μm H [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/glass-material-en/5997/">Sapphire Glass Drilling (2)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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		<title>Drilling and Internal Processing of Tempered Glass</title>
		<link>https://www.spectronix.co.jp/en/material-en/glass-material-en/5995/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e5%25bc%25b7%25e5%258c%2596%25e3%2582%25ac%25e3%2583%25a9%25e3%2582%25b9%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%2591%25e3%2583%25bb%25e5%2586%2585%25e9%2583%25a8%25e5%258a%25a0%25e5%25b7%25a5</link>
					<comments>https://www.spectronix.co.jp/en/material-en/glass-material-en/5995/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Thu, 08 Jun 2023 05:15:38 +0000</pubDate>
				<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[Marking]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5995</guid>

					<description><![CDATA[<p>Plate Thickness: 700 μm Hole Diameter on the Light-Emitting Side: 4900 μm (large)　2750 μm (small) Hole Diamete [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/glass-material-en/5995/">Drilling and Internal Processing of Tempered Glass</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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		<title>Soda Lime Glass Cutting</title>
		<link>https://www.spectronix.co.jp/en/material-en/glass-material-en/5992/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25bd%25e3%2583%25bc%25e3%2583%2580%25e3%2582%25ac%25e3%2583%25a9%25e3%2582%25b9%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad</link>
					<comments>https://www.spectronix.co.jp/en/material-en/glass-material-en/5992/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Wed, 07 Jun 2023 05:13:38 +0000</pubDate>
				<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5992</guid>

					<description><![CDATA[<p>Perimeter Cut Plate Thickness: 700 μm Length of light-emitting side: 682.9 μm (short side) Length of outlet si [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/glass-material-en/5992/">Soda Lime Glass Cutting</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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		<title>Single-Crystal Diamond Full Cut</title>
		<link>https://www.spectronix.co.jp/en/material-en/glass-material-en/5990/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e5%258d%2598%25e7%25b5%2590%25e6%2599%25b6%25e3%2583%2580%25e3%2582%25a4%25e3%2583%25a4%25e3%2583%25a2%25e3%2583%25b3%25e3%2583%2589%25e3%2581%25ae%25e3%2583%2595%25e3%2583%25ab%25e3%2582%25ab%25e3%2583%2583%25e3%2583%2588</link>
					<comments>https://www.spectronix.co.jp/en/material-en/glass-material-en/5990/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Mon, 29 May 2023 05:12:05 +0000</pubDate>
				<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LVE-G05N1]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5990</guid>

					<description><![CDATA[<p>Thickness: 1 mm Number of Scans: 200 The use of high-energy 532 nm nanosecond lasers makes it possible to cut  [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/glass-material-en/5990/">Single-Crystal Diamond Full Cut</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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		<title>PCD Debossing</title>
		<link>https://www.spectronix.co.jp/en/material-en/5962/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=pcd%25e3%2581%25ae%25e5%2587%25b9%25e5%258a%25a0%25e5%25b7%25a5</link>
					<comments>https://www.spectronix.co.jp/en/material-en/5962/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Thu, 18 May 2023 03:28:28 +0000</pubDate>
				<category><![CDATA[Examples of Processing（By Material）]]></category>
		<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LVE-G05N1]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5962</guid>

					<description><![CDATA[<p>Engraving height: 200 μm Engraving width (bottom): 400 μm</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/5962/">PCD Debossing</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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		<title>Single-Crystal Diamond Debossing</title>
		<link>https://www.spectronix.co.jp/en/material-en/5988/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e5%258d%2598%25e7%25b5%2590%25e6%2599%25b6%25e3%2583%2580%25e3%2582%25a4%25e3%2583%25a4%25e3%2583%25a2%25e3%2583%25b3%25e3%2583%2589%25e3%2581%25ae%25e5%2587%25b9%25e5%258a%25a0%25e5%25b7%25a5</link>
					<comments>https://www.spectronix.co.jp/en/material-en/5988/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Wed, 17 May 2023 05:10:22 +0000</pubDate>
				<category><![CDATA[Examples of Processing（By Material）]]></category>
		<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Examples of Processing（By Type of Processing）]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5988</guid>

					<description><![CDATA[<p>Engraving height: 200 μm Engraving width (bottom): 400 μm &#160;</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/5988/">Single-Crystal Diamond Debossing</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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