{"id":6469,"date":"2023-10-27T11:25:37","date_gmt":"2023-10-27T02:25:37","guid":{"rendered":"https:\/\/www.spectronix.co.jp\/?p=6469"},"modified":"2023-11-28T11:35:25","modified_gmt":"2023-11-28T02:35:25","slug":"realization-of-sub-4-%ce%bcm-laser-microvia-on-abf","status":"publish","type":"post","link":"https:\/\/www.spectronix.co.jp\/en\/news-en\/6469\/","title":{"rendered":"Realization of sub-4 \u03bcm laser microvia on ABF"},"content":{"rendered":"<p>We, together with the University of Tokyo, Ajinomoto Fine Techno Co., Ltd. and Mitsubishi Electric Corporation, have now achieved sub-\u03c64\u00b5m processing in the ultra-fine laser drilling technology for package substrates, which is necessary for next-generation semiconductor manufacturing processes.<\/p>\n<p>This time, we have updated our previous announcement on \u03c66\u00b5m hole drilling in 2022, and have achieved sub-\u03c64\u00b5m ultrafine Via drilling on 5\u00b5m thick ABF, demonstrating that we can realize high-quality, high-productivity drilling that will contribute to next-generation semiconductor manufacturing.<\/p>\n<p>We will continue to aim for further miniaturization and higher quality of semiconductor package substrates and contribute to strengthening Japan&#8217;s competitiveness in the next-generation semiconductor industry.<\/p>\n<p>The University of Tokyo presented an oral session of this technology at <a href=\"https:\/\/www.impact.org.tw\/site\/order\/1283\/SessionDetail.aspx?sid=1283&amp;lang=en&amp;snid=OS1\" target=\"_blank\" rel=\"noopener\">IMPACT2023<\/a>, an international conference on semiconductor packaging technology held in Taiwan from October 25 to 27, 2023.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>We, together with the University of Tokyo, Ajinomoto Fine Techno Co., Ltd. and Mitsubishi Electric Corporation [&hellip;]<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_mi_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"_locale":"en_US","_original_post":"https:\/\/www.spectronix.co.jp\/?p=6465"},"categories":[228,230],"tags":[],"_links":{"self":[{"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/posts\/6469"}],"collection":[{"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/comments?post=6469"}],"version-history":[{"count":2,"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/posts\/6469\/revisions"}],"predecessor-version":[{"id":6471,"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/posts\/6469\/revisions\/6471"}],"wp:attachment":[{"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/media?parent=6469"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/categories?post=6469"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.spectronix.co.jp\/wp-json\/wp\/v2\/tags?post=6469"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}