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	<title>Drilling | Picosecond Laser Oscillator Spectronix</title>
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	<description>超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</description>
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	<title>Drilling | Picosecond Laser Oscillator Spectronix</title>
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		<title>Deep hole drilling of glass</title>
		<link>https://www.spectronix.co.jp/en/material-en/6430/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=deep-hole-drilling-of-glass</link>
		
		<dc:creator><![CDATA[spectronix-wp]]></dc:creator>
		<pubDate>Fri, 04 Aug 2023 06:28:55 +0000</pubDate>
				<category><![CDATA[Examples of Processing（By Material）]]></category>
		<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Examples of Processing（By Type of Processing）]]></category>
		<category><![CDATA[Drilling]]></category>
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					<description><![CDATA[<p>Surface hole diameter: φ14um Back hole diameter: φ2um　 Even thick glass can be penetrated with high aspect rat [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/6430/">Deep hole drilling of glass</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
		
		
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		<title>Blind Via Processing on a Flexible Substrate (CCL)</title>
		<link>https://www.spectronix.co.jp/en/material-en/5883/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%2595%25e3%2583%25ac%25e3%2582%25ad%25e3%2582%25b7%25e3%2583%2596%25e3%2583%25ab%25e5%259f%25ba%25e6%259d%25bf%25e6%259d%2590%25e6%2596%2599ccl%25e3%2581%25aeblind-via%25e5%258a%25a0%25e5%25b7%25a5</link>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Wed, 21 Jun 2023 05:01:37 +0000</pubDate>
				<category><![CDATA[Examples of Processing（By Material）]]></category>
		<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Examples of Processing（By Type of Processing）]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-X0810]]></category>
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					<description><![CDATA[<p>Top Diameter：φ40μmm Bottom Diameter：φ20μm Depth：50μm Blind Via with no warping or dents in the bottom copper f [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/5883/">Blind Via Processing on a Flexible Substrate (CCL)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
		
		
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		<item>
		<title>Si Wafer Drilling</title>
		<link>https://www.spectronix.co.jp/en/material-en/5860/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=si%25e3%2582%25a6%25e3%2582%25a8%25e3%2583%258f%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%2591</link>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Tue, 20 Jun 2023 03:19:25 +0000</pubDate>
				<category><![CDATA[Examples of Processing（By Material）]]></category>
		<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5860</guid>

					<description><![CDATA[<p>Drilling Surface Hole Diameter: 50 μm Back Hole Diameter: 20 μm No cracks and minimal thermal impact results i [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/5860/">Si Wafer Drilling</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
		
		
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		<item>
		<title>Alumina Drilling (1)</title>
		<link>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6012/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25a2%25e3%2583%25ab%25e3%2583%259f%25e3%2583%258a%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25911</link>
					<comments>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6012/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Mon, 12 Jun 2023 05:34:13 +0000</pubDate>
				<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=6012</guid>

					<description><![CDATA[<p>Plate Thickness: 200 μm Number of Holes: 20 × 20 holes (400 holes) Hole Diameter Light-emitting side: φ80 μm O [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6012/">Alumina Drilling (1)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
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		<title>Sapphire Glass Drilling（1）</title>
		<link>https://www.spectronix.co.jp/en/material-en/glass-material-en/5999/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25b5%25e3%2583%2595%25e3%2582%25a1%25e3%2582%25a4%25e3%2582%25a2%25e3%2582%25ac%25e3%2583%25a9%25e3%2582%25b9%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25911</link>
					<comments>https://www.spectronix.co.jp/en/material-en/glass-material-en/5999/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Sat, 10 Jun 2023 05:18:52 +0000</pubDate>
				<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5999</guid>

					<description><![CDATA[<p>Plate Thickness: 1000 μm Number of Holes: 16 (1.1 mm pitch) Hole Diameter on the Light-Emitting Side: 1000 μm  [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/glass-material-en/5999/">Sapphire Glass Drilling（1）</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Sapphire Glass Drilling (2)</title>
		<link>https://www.spectronix.co.jp/en/material-en/glass-material-en/5997/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25b5%25e3%2583%2595%25e3%2582%25a1%25e3%2582%25a4%25e3%2582%25a2%25e3%2582%25ac%25e3%2583%25a9%25e3%2582%25b9%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25912</link>
					<comments>https://www.spectronix.co.jp/en/material-en/glass-material-en/5997/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Fri, 09 Jun 2023 05:17:22 +0000</pubDate>
				<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5997</guid>

					<description><![CDATA[<p>Plate Thickness: 300 μm Number of Holes: 16 (1.1 mm pitch) Hole Diameter on the Light-Emitting Side: 1030 μm H [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/glass-material-en/5997/">Sapphire Glass Drilling (2)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Drilling and Internal Processing of Tempered Glass</title>
		<link>https://www.spectronix.co.jp/en/material-en/glass-material-en/5995/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e5%25bc%25b7%25e5%258c%2596%25e3%2582%25ac%25e3%2583%25a9%25e3%2582%25b9%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%2591%25e3%2583%25bb%25e5%2586%2585%25e9%2583%25a8%25e5%258a%25a0%25e5%25b7%25a5</link>
					<comments>https://www.spectronix.co.jp/en/material-en/glass-material-en/5995/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Thu, 08 Jun 2023 05:15:38 +0000</pubDate>
				<category><![CDATA[Glass and Diamond]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[Marking]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5995</guid>

					<description><![CDATA[<p>Plate Thickness: 700 μm Hole Diameter on the Light-Emitting Side: 4900 μm (large)　2750 μm (small) Hole Diamete [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/glass-material-en/5995/">Drilling and Internal Processing of Tempered Glass</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
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		<title>Polyimide Drilling (1)</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5979/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%259d%25e3%2583%25aa%25e3%2582%25a4%25e3%2583%259f%25e3%2583%2589%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25911</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5979/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Mon, 05 Jun 2023 05:02:32 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5979</guid>

					<description><![CDATA[<p>t = 0.125 mm φ300 μｍｘ2900 holes Hole Diameter on the Light-Emitting Side: φ300 μｍ Hole Diameter on the Outlet  [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5979/">Polyimide Drilling (1)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Polyimide Drilling (2)</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5977/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%259d%25e3%2583%25aa%25e3%2582%25a4%25e3%2583%259f%25e3%2583%2589%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25912</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5977/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Sun, 04 Jun 2023 05:01:27 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5977</guid>

					<description><![CDATA[<p>t = 0.125 mm φ300 μｍ x 1600 holes Hole Diameter on the Light-Emitting Side: φ300 μｍ Hole Diameter on the Outle [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5977/">Polyimide Drilling (2)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Alumina Drilling (2)</title>
		<link>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6003/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25a2%25e3%2583%25ab%25e3%2583%259f%25e3%2583%258a%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25912</link>
					<comments>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6003/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Thu, 01 Jun 2023 05:27:56 +0000</pubDate>
				<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=6003</guid>

					<description><![CDATA[<p>100 holes/second</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6003/">Alumina Drilling (2)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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