Examples of Si Wafer Drilling

  • Outer Surface

  • Inner Surface

  • Outer Surface Enlarged

  • Inner Surface Enlarged

Overview and Features of Processing Method

Drilling Surface Hole Diameter: 50 μm Back Hole Diameter: 20 μm

No cracks and minimal thermal impact results in a clean edge.

Processing Material

Si wafers　280 μmt

Products Made With This Processing
LDH-V1610
Demo Room Guide

Processing Experiments Using Spectronix Products.