See here for inquiries or consultations regarding laser products
Hours: Weekdays 9:00 a.m. to 5:00 p.m.
(Japan Standard Time)
Examples of Si Wafer Drilling
-
Outer Surface
-
Inner Surface
-
Outer Surface Enlarged
-
Inner Surface Enlarged
Overview and Features of Processing Method
Drilling Surface Hole Diameter: 50 μm Back Hole Diameter: 20 μm
No cracks and minimal thermal impact results in a clean edge.
Processing Material
Si wafers 280 μmt
- Products Made With This Processing
Processing experiments for the installation of our products are available in our demo room. Please contact us for details.
