Examples of Blind Via Processing on a Flexible Substrate (CCL)

  • Irradiation Surface

  • Inner Surface

  • 3D image

     

     

Overview and Features of Processing Method

Top Diameter：φ40μmm
Bottom Diameter：φ20μm
Depth：50μm

Blind Via with no warping or dents in the bottom copper foil.

Processing Material

Flexible substrate material (provided by Panasonic Industry Co., Ltd., FELIOS LCP R-F700S)

Products Made With This Processing
LDH-X0810
Demo Room Guide

Processing Experiments Using Spectronix Products.