Examples of Blind Via Processing on a Flexible Substrate (CCL)

Overview and Features of Processing Method

Top Diameter:φ40μmm
Bottom Diameter:φ20μm

Blind Via with no warping or dents in the bottom copper foil.

Processing Material

Flexible substrate material (provided by Panasonic Industry Co., Ltd., FELIOS LCP R-F700S)

Products Made With This Processing
Demo Room Guide

Processing Experiments Using Spectronix Products.