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	<title>Ceramic and Semiconductor Materials | Picosecond Laser Oscillator Spectronix</title>
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	<description>超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</description>
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	<title>Ceramic and Semiconductor Materials | Picosecond Laser Oscillator Spectronix</title>
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		<title>Si Wafer Drilling</title>
		<link>https://www.spectronix.co.jp/en/material-en/5860/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=si%25e3%2582%25a6%25e3%2582%25a8%25e3%2583%258f%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%2591</link>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Tue, 20 Jun 2023 03:19:25 +0000</pubDate>
				<category><![CDATA[Examples of Processing（By Material）]]></category>
		<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
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					<description><![CDATA[<p>Drilling Surface Hole Diameter: 50 μm Back Hole Diameter: 20 μm No cracks and minimal thermal impact results i [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/5860/">Si Wafer Drilling</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
		
		
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		<title>Aluminum Nitride Cutting</title>
		<link>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6014/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e7%25aa%2592%25e5%258c%2596%25e3%2582%25a2%25e3%2583%25ab%25e3%2583%259f%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad</link>
					<comments>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6014/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Tue, 13 Jun 2023 05:35:31 +0000</pubDate>
				<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
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					<description><![CDATA[<p>Plate Thickness: 120 μm Number of Holes: 19 Remaining Dimensions Light-emitting side: 100 μm Outlet side: 120  [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6014/">Aluminum Nitride Cutting</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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		<title>Alumina Drilling (1)</title>
		<link>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6012/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25a2%25e3%2583%25ab%25e3%2583%259f%25e3%2583%258a%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25911</link>
					<comments>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6012/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Mon, 12 Jun 2023 05:34:13 +0000</pubDate>
				<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=6012</guid>

					<description><![CDATA[<p>Plate Thickness: 200 μm Number of Holes: 20 × 20 holes (400 holes) Hole Diameter Light-emitting side: φ80 μm O [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6012/">Alumina Drilling (1)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			</item>
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		<title>PZT Cutting</title>
		<link>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6010/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=pzt%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad</link>
					<comments>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6010/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Sun, 11 Jun 2023 05:33:02 +0000</pubDate>
				<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=6010</guid>

					<description><![CDATA[<p>Plate Thickness: 200 μm Remaining Dimensions Light-emitting side: 100 μm Outlet side: 145 μm</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6010/">PZT Cutting</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Alumina Cutting (1)</title>
		<link>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6008/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25a2%25e3%2583%25ab%25e3%2583%259f%25e3%2583%258a%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad%25ef%25bc%25881%25ef%25bc%2589</link>
					<comments>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6008/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Fri, 02 Jun 2023 05:30:40 +0000</pubDate>
				<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
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					<description><![CDATA[<p>t = 0.2 mm, height: 10.4 mm, hexagonal x 19 holes</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6008/">Alumina Cutting (1)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Alumina Cutting (2)</title>
		<link>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6005/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25a2%25e3%2583%25ab%25e3%2583%259f%25e3%2583%258a%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad2</link>
					<comments>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6005/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Fri, 02 Jun 2023 05:29:11 +0000</pubDate>
				<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=6005</guid>

					<description><![CDATA[<p>t = 0.2 mm 1 mm square ｘ25 holes</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6005/">Alumina Cutting (2)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Alumina Drilling (2)</title>
		<link>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6003/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25a2%25e3%2583%25ab%25e3%2583%259f%25e3%2583%258a%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25912</link>
					<comments>https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6003/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Thu, 01 Jun 2023 05:27:56 +0000</pubDate>
				<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=6003</guid>

					<description><![CDATA[<p>100 holes/second</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/ceramic-material-en/6003/">Alumina Drilling (2)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
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		<item>
		<title>Ceramics Cutting</title>
		<link>https://www.spectronix.co.jp/en/material-en/6001/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2582%25bb%25e3%2583%25a9%25e3%2583%259f%25e3%2583%2583%25e3%2582%25af%25e3%2582%25b9%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad</link>
					<comments>https://www.spectronix.co.jp/en/material-en/6001/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Fri, 19 May 2023 05:26:15 +0000</pubDate>
				<category><![CDATA[Examples of Processing（By Material）]]></category>
		<category><![CDATA[Ceramic and Semiconductor Materials]]></category>
		<category><![CDATA[Examples of Processing（By Type of Processing）]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-G2510-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=6001</guid>

					<description><![CDATA[<p>Thickness: 1.0 mm Number of Scans: 1000 Materials such as zirconia are difficult to process even with lasers a [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/6001/">Ceramics Cutting</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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