Examples of Processing（By Material） | Picosecond Laser Oscillator Spectronix https://www.spectronix.co.jp/en 超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス Fri, 04 Aug 2023 06:28:55 +0000 en-US hourly 1 https://www.spectronix.co.jp/wp-content/uploads/2023/07/favicon.gif Examples of Processing（By Material） | Picosecond Laser Oscillator Spectronix https://www.spectronix.co.jp/en 32 32 Deep hole drilling of glass https://www.spectronix.co.jp/en/material-en/6430/?utm_source=rss&utm_medium=rss&utm_campaign=deep-hole-drilling-of-glass Fri, 04 Aug 2023 06:28:55 +0000 https://www.spectronix.co.jp/?p=6430 Surface hole diameter: φ14um Back hole diameter: φ2um　 Even thick glass can be penetrated with high aspect rat […]

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]]> Au Film Patterning for Glass Substrates https://www.spectronix.co.jp/en/material-en/6162/?utm_source=rss&utm_medium=rss&utm_campaign=au-film-patterning-for-glass-substrates Fri, 23 Jun 2023 04:07:56 +0000 https://www.spectronix.co.jp/?p=6162 Au Film Thickness: 100 nm Processing Area: 500 μm × 500 μm　Intervals: 300 μm Synchronization with an external […]

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]]> ITO Film Patterning https://www.spectronix.co.jp/en/material-en/5651/?utm_source=rss&utm_medium=rss&utm_campaign=ito%25e8%2586%259c%25e3%2581%25ae%25e3%2583%2591%25e3%2582%25bf%25e3%2583%25bc%25e3%2583%258b%25e3%2583%25b3%25e3%2582%25b0-2 Thu, 22 Jun 2023 00:08:52 +0000 https://www.spectronix.co.jp/?p=5651 Patterning　Processing Width: 5 um　　Space Width: 2 um Laser focusing characteristics ideal for fine line proces […]

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]]> Blind Via Processing on a Flexible Substrate (CCL) https://www.spectronix.co.jp/en/material-en/5883/?utm_source=rss&utm_medium=rss&utm_campaign=%25e3%2583%2595%25e3%2583%25ac%25e3%2582%25ad%25e3%2582%25b7%25e3%2583%2596%25e3%2583%25ab%25e5%259f%25ba%25e6%259d%25bf%25e6%259d%2590%25e6%2596%2599ccl%25e3%2581%25aeblind-via%25e5%258a%25a0%25e5%25b7%25a5 Wed, 21 Jun 2023 05:01:37 +0000 https://www.spectronix.co.jp/?p=5883 Top Diameter：φ40μmm Bottom Diameter：φ20μm Depth：50μm Blind Via with no warping or dents in the bottom copper f […]

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]]> Si Wafer Drilling https://www.spectronix.co.jp/en/material-en/5860/?utm_source=rss&utm_medium=rss&utm_campaign=si%25e3%2582%25a6%25e3%2582%25a8%25e3%2583%258f%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%2591 Tue, 20 Jun 2023 03:19:25 +0000 https://www.spectronix.co.jp/?p=5860 Drilling Surface Hole Diameter: 50 μm Back Hole Diameter: 20 μm No cracks and minimal thermal impact results i […]

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]]> Copper Dimpling https://www.spectronix.co.jp/en/material-en/metal-en/5659/?utm_source=rss&utm_medium=rss&utm_campaign=%25e9%258a%2585%25e3%2581%25ae%25e3%2583%2587%25e3%2582%25a3%25e3%2583%25b3%25e3%2583%2597%25e3%2583%25ab%25e5%258a%25a0%25e5%25b7%25a5 https://www.spectronix.co.jp/en/material-en/metal-en/5659/#respond Sun, 18 Jun 2023 11:56:02 +0000 https://www.spectronix.co.jp/?p=5659 Dimple Depth: 55-60 μm Dimple Size: 180 μm Dimple Pitch: 195 μm

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]]> https://www.spectronix.co.jp/en/material-en/metal-en/5659/feed/ 0 CFRP Cutting https://www.spectronix.co.jp/en/material-en/composite-en/5965/?utm_source=rss&utm_medium=rss&utm_campaign=cfrp%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad https://www.spectronix.co.jp/en/material-en/composite-en/5965/#respond Sat, 17 Jun 2023 06:47:00 +0000 https://www.spectronix.co.jp/?p=5965 Plate Thickness: 200 μm Cutting Dimensions: φ16 mm Diameter of the Light-Emitting Side: 16.041 mm Diameter of […]

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]]> https://www.spectronix.co.jp/en/material-en/composite-en/5965/feed/ 0 CFRP Grooving https://www.spectronix.co.jp/en/material-en/composite-en/5967/?utm_source=rss&utm_medium=rss&utm_campaign=cfrp%25e3%2581%25ae%25e6%25ba%259d%25e5%258a%25a0%25e5%25b7%25a5 https://www.spectronix.co.jp/en/material-en/composite-en/5967/#respond Fri, 16 Jun 2023 05:53:37 +0000 https://www.spectronix.co.jp/?p=5967 Plate Thickness: 200 μm Right Groove Depth: 51.2 μm Left Groove Depth: 22.2 μm

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]]> https://www.spectronix.co.jp/en/material-en/composite-en/5967/feed/ 0 Polyimide Cutting https://www.spectronix.co.jp/en/material-en/resin-en/5986/?utm_source=rss&utm_medium=rss&utm_campaign=%25e3%2583%259d%25e3%2583%25aa%25e3%2582%25a4%25e3%2583%259f%25e3%2583%2589%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad https://www.spectronix.co.jp/en/material-en/resin-en/5986/#respond Thu, 15 Jun 2023 05:07:44 +0000 https://www.spectronix.co.jp/?p=5986 Plate Thickness: 120 μm Hole Diameter: φ200 μm × 3200 holes Diameter of the Light-Emitting Side: φ221.18 μm Di […]

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]]> https://www.spectronix.co.jp/en/material-en/resin-en/5986/feed/ 0 PTFE Cutting (1) https://www.spectronix.co.jp/en/material-en/resin-en/5970/?utm_source=rss&utm_medium=rss&utm_campaign=ptfe%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad1 https://www.spectronix.co.jp/en/material-en/resin-en/5970/#respond Wed, 14 Jun 2023 05:05:44 +0000 https://www.spectronix.co.jp/?p=5970 Plate Thickness: 200 μm Cutting Dimensions: φ16 mm Diameter of the Light-Emitting Side: 16.041 mm Diameter of […]

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