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	<title>Resin and Film | Picosecond Laser Oscillator Spectronix</title>
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	<description>超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</description>
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	<title>Resin and Film | Picosecond Laser Oscillator Spectronix</title>
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		<title>Blind Via Processing on a Flexible Substrate (CCL)</title>
		<link>https://www.spectronix.co.jp/en/material-en/5883/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%2595%25e3%2583%25ac%25e3%2582%25ad%25e3%2582%25b7%25e3%2583%2596%25e3%2583%25ab%25e5%259f%25ba%25e6%259d%25bf%25e6%259d%2590%25e6%2596%2599ccl%25e3%2581%25aeblind-via%25e5%258a%25a0%25e5%25b7%25a5</link>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Wed, 21 Jun 2023 05:01:37 +0000</pubDate>
				<category><![CDATA[Examples of Processing（By Material）]]></category>
		<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Examples of Processing（By Type of Processing）]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-X0810]]></category>
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					<description><![CDATA[<p>Top Diameter：φ40μmm Bottom Diameter：φ20μm Depth：50μm Blind Via with no warping or dents in the bottom copper f [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/5883/">Blind Via Processing on a Flexible Substrate (CCL)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
		
		
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		<item>
		<title>Polyimide Cutting</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5986/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%259d%25e3%2583%25aa%25e3%2582%25a4%25e3%2583%259f%25e3%2583%2589%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5986/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Thu, 15 Jun 2023 05:07:44 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5986</guid>

					<description><![CDATA[<p>Plate Thickness: 120 μm Hole Diameter: φ200 μm × 3200 holes Diameter of the Light-Emitting Side: φ221.18 μm Di [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5986/">Polyimide Cutting</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			</item>
		<item>
		<title>PTFE Cutting (1)</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5970/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=ptfe%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad1</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5970/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Wed, 14 Jun 2023 05:05:44 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5970</guid>

					<description><![CDATA[<p>Plate Thickness: 200 μm Cutting Dimensions: φ16 mm Diameter of the Light-Emitting Side: 16.041 mm Diameter of  [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5970/">PTFE Cutting (1)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Polyimide Grooving</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5981/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%259d%25e3%2583%25aa%25e3%2582%25a4%25e3%2583%259f%25e3%2583%2589%25e3%2581%25ae%25e6%25ba%259d%25e5%258a%25a0%25e5%25b7%25a5</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5981/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Tue, 06 Jun 2023 05:03:38 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5981</guid>

					<description><![CDATA[<p>Polyimide Ablation t = 0.025 mm (copper wire diameter φ0.9 mm) Hole Diameter on the Light-Emitting Side: Φ520  [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5981/">Polyimide Grooving</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			</item>
		<item>
		<title>Polyimide Drilling (1)</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5979/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%259d%25e3%2583%25aa%25e3%2582%25a4%25e3%2583%259f%25e3%2583%2589%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25911</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5979/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Mon, 05 Jun 2023 05:02:32 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5979</guid>

					<description><![CDATA[<p>t = 0.125 mm φ300 μｍｘ2900 holes Hole Diameter on the Light-Emitting Side: φ300 μｍ Hole Diameter on the Outlet  [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5979/">Polyimide Drilling (1)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			<slash:comments>0</slash:comments>
		
		
			</item>
		<item>
		<title>Polyimide Drilling (2)</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5977/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%259d%25e3%2583%25aa%25e3%2582%25a4%25e3%2583%259f%25e3%2583%2589%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25912</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5977/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Sun, 04 Jun 2023 05:01:27 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5977</guid>

					<description><![CDATA[<p>t = 0.125 mm φ300 μｍ x 1600 holes Hole Diameter on the Light-Emitting Side: φ300 μｍ Hole Diameter on the Outle [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5977/">Polyimide Drilling (2)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			</item>
		<item>
		<title>Polyimide Drilling (3)</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5975/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%259d%25e3%2583%25aa%25e3%2582%25a4%25e3%2583%259f%25e3%2583%2589%25e3%2581%25ae%25e7%25a9%25b4%25e3%2581%2582%25e3%2581%25913</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5975/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Tue, 30 May 2023 04:59:26 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Drilling]]></category>
		<category><![CDATA[LDH-V1610-en]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5975</guid>

					<description><![CDATA[<p>Thickness = 12.5 μm 200 μm pitch &#160;</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5975/">Polyimide Drilling (3)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			</item>
		<item>
		<title>PET Cutting</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5973/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=pet%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5973/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Sun, 28 May 2023 04:56:43 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-X0810]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5973</guid>

					<description><![CDATA[<p>Processing is possible without moving the focal point for thicknesses of 0.5 mm. There is no thermal deformati [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5973/">PET Cutting</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			</item>
		<item>
		<title>Polyimide Round Cutting</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5971/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=%25e3%2583%259d%25e3%2583%25aa%25e3%2582%25a4%25e3%2583%259f%25e3%2583%2589%25e3%2581%25ae%25e5%2586%2586%25e5%25bd%25a2%25e5%2588%2587%25e6%2596%25ad</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5971/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Sat, 27 May 2023 04:54:25 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-X0810]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5971</guid>

					<description><![CDATA[<p>Diameter: φ30 mm Thickness: 0.12 mm Number of Scans: 100 A polyimide sample was cut out using a DUV picosecond [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5971/">Polyimide Round Cutting</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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			</item>
		<item>
		<title>PTFE Cutting (2)</title>
		<link>https://www.spectronix.co.jp/en/material-en/resin-en/5968/?utm_source=rss&#038;utm_medium=rss&#038;utm_campaign=ptfe%25e3%2581%25ae%25e5%2588%2587%25e6%2596%25ad2</link>
					<comments>https://www.spectronix.co.jp/en/material-en/resin-en/5968/#respond</comments>
		
		<dc:creator><![CDATA[yodoq]]></dc:creator>
		<pubDate>Fri, 26 May 2023 04:50:37 +0000</pubDate>
				<category><![CDATA[Resin and Film]]></category>
		<category><![CDATA[Cutting and Grooving]]></category>
		<category><![CDATA[LDH-X0810]]></category>
		<guid isPermaLink="false">https://www.spectronix.co.jp/?p=5968</guid>

					<description><![CDATA[<p>Diameter: φ50 mm Thickness: 0.2 mm Number of Scans: 250 High-quality processing with reduced melt loss and hea [&#8230;]</p>
<p>The post <a href="https://www.spectronix.co.jp/en/material-en/resin-en/5968/">PTFE Cutting (2)</a> first appeared on <a href="https://www.spectronix.co.jp/en">超短パルス/ピコ秒レーザ｜レーザ発振器のスペクトロニクス</a>.</p>]]></description>
		
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