Realization of the world’s smallest hole drilling on semiconductor substrates

We, together with the University of Tokyo, Ajinomoto Fine Techno Co., Ltd. and Mitsubishi Electric Corporation, have developed a 3-micrometer laser drilling technology for package substrates, which is necessary for next-generation semiconductor manufacturing processes.

For details, please see the press release (Japanese).

By establishing a drilling processing technology that is one order of magnitude smaller than existing technology, higher density interconnections between substrates will be realized, which is expected to be useful for the development of chiplets for high-performance computers and data centers required for future generative AI and other applications.

We will continue to work together to further miniaturize and improve the quality of semiconductor package substrate and contribute to strengthening Japan’s competitiveness in the next-generation semiconductor industry.

The University of Tokyo presented details of the resulting technology at the international conference ECTC2024 (May 28-31, 2024 in Denver, USA).