We are pleased to announce that we have raised 510 million yen in a third-party allotment of new shares.

This financing is the result of the Series E round initiated in August 2023, with contributions from a total of four investors, including venture capital funds and a corporate entity. These investors share our mission of contributing to the miniaturization needs of semiconductors and electronic components through our ultra-short pulse and deep ultraviolet (DUV) laser technology.

With this financing, we aim to accelerate the market introduction of picosecond pulsed DUV 266nm laser oscillators with the world’s highest output and longest lifetime*, which leverage our proprietary LD-GS technology.  We will enhance our development and mass production capabilities to meet demands of semiconductor and advanced materials microfabrication, strengthen our sales and service networks both domestically and internationally, and reinforce our management foundation and talent acquisition efforts.

* According to our research, as of February 1, 2024


  • Third-party allotment subscribers for Round E

– Innovation Platform Fund 1 Investment Limited Partnership
Unlimited liability partner UTokyo Innovation Platform Co., Ltd.
(Headquarters: Bunkyo-ku, Tokyo / President & CEO, Representative Director: Kosuke Ueda)

– QB II Investment Limited Partnership
General Partner QB2Partners, LLP
Partner QB Capital, LLC
(Headquarters: Sawara-ku, Fukuoka / Managing Partner: Tsuyoshi Sakamoto, Takashi Hondo)
General Partner NCB Venture Capital Co., Ltd.
(Headquarters: Chuo-ku, Fukuoka / President: Issei Inoue)

– Via Mechanics, Ltd.
(Headquarters: Atsugi-shi, Kanagawa / President & CEO, Representative Director: Hideaki Shimizu)

– MIRAI SOUZOU Fund 2 Investment Limited Partnership
Unlimited liability partner Innovations and Future Creation Inc. (MIRAI SOUZOU)
(Headquarters: Minato-ku, Tokyo / CEO: Hiroyuki Okada)


For inquiries regarding this, please contact us here.